Technical Ceramic Laser Scribing & Snap Dicing Calculator

4. Engineering Notes & Physics Specifications

Technical Ceramic Laser Scribing uses pulsed CO2 (10.6 µm) or fiber (1064 nm / 532 nm) lasers to drill a series of closely spaced, blind micro-holes along dicing street vectors. Rapid localized thermal shock initiates a vertical "median vent crack" that propagates from the crater tip through $60\% - 80\%$ of the substrate thickness. The scribed wafer is then mechanically cleaved ("snapped") along the stress line with zero coolant water, zero kerf loss, and high yield.

• Scribe Depth Ratio ($h_s / t$): Optimal snap cleaving requires $35\% \le h_s / t \le 50\%$. Under-scribing ($< 30\%$) causes uncontrolled breakout cracks; over-scribing ($> 60\%$) creates extensive thermal spattering and micro-chipping.
• Hole Spacing Pitch ($P = v_s / f$): Optimal pitch is $120 - 200 ext{ µm}$. If holes overlap ($P < 80 ext{ µm}$), excessive heat causes surface slag fusion and thermal fracture; if pitch is too wide ($P > 300 ext{ µm}$), the crack deviates between holes.
• Street Intersection Skip Gap ($L_{ ext{skip}}$): At perpendicular street crossings, turn off the laser for $1.5 - 2.5 \cdot t$ before and after the intersection to avoid double-pulsing and corner blowout.