3D-MID & Printed Electronics

Laser Direct Structuring (LDS) & 3D-MID Prepress Calculator

Calculate laser fluence, pulse overlap, 3D surface normal slope angle compensation, hatch stepover pitch, and electroless copper trace resistance for 3D molded interconnect devices.

1. Input Parameters

Laser Output Power (Watts)

Average DPSS Nd:YVO4 or Fiber laser power (typically 8 - 18 W at 1064nm).

Galvo Scan Speed (mm/s)

Beam deflection velocity across the 3D molded substrate.

Pulse Frequency (kHz)

Q-switch repetition rate (kHz).

Focal Spot Diameter (µm)

1/e² laser beam waist diameter on focal plane.

Hatch Stepover Pitch (µm)

Spacing between adjacent parallel vector scan lines.

3D Surface Normal Slope Angle (Degrees)

Angle between surface normal and laser beam axis (θ ≤ 60° recommended).

Target Conductor Trace Width (mm)

Final metallized circuit trace width.

Conductor Trace Length (mm)

Total length of conductive run on 3D part.

Electroless Copper Layer Thickness (µm)

Target autocatalytic copper deposition depth (typically 8 - 15 µm).

2. Calculation Results

Pulse Overlap

68.5%

Linear Energy Input

4.80 J/m

Nominal Area Fluence

19.2 J/cm²

Effective Slope Fluence

16.6 J/cm²

Activation Roughness (Ra)

2.45 µm

Trace DC Resistance

0.18 Ω

3. Dynamic Visualizer & CAM Preview

4. Engineering Notes & Physics Specifications

Laser Direct Structuring (LDS) uses a diode-pumped Nd:YVO4 or fiber laser (1064 nm) to chemically break down and activate organometallic copper/metal complex additive seeds embedded within injection-molded engineering thermoplastics (e.g. LCP, PEEK, PC/ABS, PA 6/6T). The ablation simultaneously creates a micro-rough anchor structure ($R_a \approx 1.5 - 3.5\text{ µm}$) that catalyzes electroless copper, nickel, and gold plating.

Pulse Overlap Ratio: $U_p = 1 - \frac{v_s}{f \cdot d_0}$. Overlaps between $60\% - 75\%$ provide complete seed uncovering without excessive polymer carbonization or thermal groove undercut.
3D Slope Normal Compensation: On 3D tilted surfaces, beam projection widens the effective spot area by $1/\cos(\theta)$. Energy density drops: $E_{\text{eff}} = E_{\text{nominal}} \cdot \cos(\theta)$. Angles exceeding $60^\circ$ require dynamic galvo speed modulation or 5-axis part tilt.
Trace Resistance: $R = \rho_{\text{cu}} \frac{L}{W \cdot t_{\text{cu}}}$, assuming electroless copper resistivity $\rho_{\text{cu}} \approx 1.72 \times 10^{-8} \ \Omega\cdot\text{m}$.

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