Microfabrication & Additive

Meniscus-Confined Electrodeposition (MCED) Growth Rate & Micro-Pillar Calculator

Model nozzle-confined electrochemical micro-printing, Faradaic ion reduction velocity, and 3D micro-pillar CAM retraction vectors.

Process & CAM Parameters

Micropipette Tip Diameter (D_tip in um):

Internal diameter of glass pulling micropipette orifice.

Faradaic Deposition Current (I_dep in nA):

Deposited Metal Ion Species:

Z-Axis Retraction Speed (v_pull in um/s):

Chamber Relative Humidity (RH %):

Engineering Calculations

Faradaic Growth Rate

1.82um/s

Volumetric Yield

8.94um3/s

Meniscus Stability

0.99Stable

Pillar Feature Aspect Ratio

45:1AR

Dynamic CAM Toolpath & Vector Preview

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Engineering Principles & Formulations

Meniscus-Confined Electrodeposition (MCED) is a nozzle-based electrochemical 3D micro-printing technique that confines an electrolyte micro-droplet meniscus between a glass micropipette aperture and a conductive substrate. Localized Faradaic reduction produces freestanding sub-micron 3D copper/gold micro-coils, interconnect pillars, and micro-sensors with room-temperature bulk metal density.

Linear Growth Velocity ($v_{\text{growth}}$): Governed by Faraday's Law: $v_{\text{growth}} = \frac{M \cdot I_{\text{dep}}}{z \cdot F \cdot \rho \cdot A_{\text{pillar}}}$.
Meniscus Stability Ratio: Defined as $\Lambda_m = \frac{v_{\text{pull}}}{v_{\text{growth}}}$. Values between $0.95 - 1.05$ maintain constant meniscus curvature without droplet rupture or nozzle contact.
Chamber Humidity: High relative humidity ($70\% - 85\%$) retards solvent evaporation at the micro-meniscus boundary.