MICROELECTRONICS & DISPLAY FPC BONDING

ACF Anisotropic Conductive Film Bonding Calculator

Calculate ACF conductive particle capture density per pad, electrode pitch vs gap safety, thermocompression pressure, and lateral short-circuit risk for display FOG/FOB and flex PCB assembly.

1. Input Parameters

Electrode / Bump Width (W_bump) [µm]

Electrode / Bump Length (L_bump) [µm]

Electrode Pitch (P_pitch) [µm]

ACF Film Grade & Particle Density

2. Calculation Results

Captured Particle Count

0 / pad

Min. Electrode Gap

0.0 µm

Bond Pressure Per Pad

0.0 MPa

Short Circuit Risk

LOW

3. Geometric Visualizer

Tooling & Vector Prepress Engineering Notes

1. Minimum Particle Capture Rule: High-reliability display and flex interconnects require $N_{\text{captured}} \ge 5 - 10\text{ conductive particles per pad}$ to ensure contact resistance $< 1.0\,\Omega$.

2. Thermocompression Profile: Standard bonding profile: Stage 1 Pre-tack ($70^\circ\text{C}, 1.0\text{ MPa}, 1.5\text{s}$), Stage 2 Main Cure ($180^\circ - 210^\circ\text{C}, 2.0 - 3.5\text{ MPa}, 5.0\text{s}$).

3. ITO / Flex Vector Layout: Pad alignment markers (crosshair fiducials) must be exported in 1:1 DXF layers for camera optical recognition systems (Toray, Panasonic, Ohashi).