MICROELECTRONICS BONDING PREPRESS
ACF Thermocompression Bonding & Flex FPC Vector Prepress Guide
Anisotropic Conductive Film (ACF) is an adhesive interconnect technology composed of conductive micro-spheres suspended in a thermosetting resin matrix. ACF enables ultra-fine-pitch electrical connections between flexible printed circuits (FPC) and display glass (FOG/COG).
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1. Micro-Particle Entrapment Mechanics
Under thermocompression ($180^\circ - 210^\circ\text{C}$ at $2.0 - 3.5\text{ MPa}$), the epoxy resin flows into the inter-pad spaces while conductive Au/Ni plated polymer spheres are compressed between mating electrodes. A minimum capture of 5 particles per pad guarantees sub-ohm electrical continuity.
2. Engineering Specifications & Tolerances
| ACF Bonding Type | Electrode Pitch Min | Particle Size | Typical Application |
|---|---|---|---|
| COG (Chip-on-Glass) | 15 – 25 µm | 2.5 – 3.0 µm | OLED / Micro-LED Driver ICs |
| FOG (Flex-on-Glass) | 30 – 50 µm | 3.0 – 4.0 µm | Display Panel Ribbon Cables |
| FOB (Flex-on-Board) | 80 – 150 µm | 5.0 – 10.0 µm | Automotive Instrumentation |
| COP (Chip-on-Plastic) | 20 – 35 µm | 3.0 µm | Foldable AMOLED Displays |
3. Optical Fiducial Alignment & Vector Prepress
- Crosshair Alignment Fiducials: Include 400µm x 400µm crosshair optical targets in 1:1 DXF format outside the active bonding zone for camera vision systems.
- Space-to-Trace Ratio: Maintain electrode space-to-width ratio >= 1.0 to prevent stray conductive particle clustering.
- Thermal Expansion Matching: Account for polyimide FPC thermal stretch (0.15% at 200°C) by applying pre-shrink compensation to the CAD layout.
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