PRECISION HARD-BRITTLE SEPARATION

Cryogenic Laser Scribing & Thermal Cleaving Calculator

Calculate laser thermal stress ($\sigma_{\text{th}}$), cryogenic liquid nitrogen ($\text{LN}_2$) thermal shock gradient ($\nabla T$), Griffith stress intensity factor ($K_I$), and blind micro-crack penetration depth for sapphire and fused quartz dicing.

1. Laser & Cryogenic Parameters

Hard-Brittle Substrate Material

Wafer / Substrate Thickness ($t$ in mm)

Substrate plate thickness.

CO2 / Fiber Laser Power ($P$ in Watts)

Continuous wave optical power delivered to the focal spot.

Cleaving Feed Velocity ($v$ in mm/s)

Linear travel speed along the programmed vector cutpath.

Cryogenic Quench Media

Laser-to-Jet Standoff Gap ($d_{\text{gap}}$ in mm)

Centerline distance between laser heating beam and cryogenic quench nozzle.

2. Thermal Stress & Cleaving Output

Peak Tensile Thermal Stress

485MPa

Stress Intensity Factor (KI)

3.62MPa√m

Cleaving Threshold Margin

+44.8%

Micro-Crack Depth (a_crack)

0.49mm

Surface Thermal Shock (ΔT)

380°C

Edge Notch Lead-In Radius

0.25mm

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