Microfluidics & Photolithography

Microfluidic Channel & Capillary Electrophoresis Phototool Calculator

Calculate isotropic wet etch undercut compensation, phototool mask line choke, electric field strength, and theoretical plate counts for microfluidic chips.

Process Parameters & Inputs

Target Microchannel Width (µm)

Final etched or molded fluidic channel width.

Channel Depth (µm)

Etch depth or master mold feature height.

Substrate & Fabrication Process

Applied Electric Potential (V)

Total high-voltage across separation channel.

Separation Column Length (cm)

Effective capillary separation distance.

Calculated CAM & Engineering Metrics

Phototool Mask Width

10.0µm

Electric Field Strength

300V/cm

Theoretical Plate Count

45,200N

Racetrack Corner Bias Radius

250µm

Engineering Notes & Guidelines

Microfluidic Phototool Design Rules:

In isotropic wet etching (HF acid on borosilicate glass), lateral undercut equals vertical etch depth ($U = D$). The phototool aperture must be choked by $2 imes D$.
Use synchronized curved serpentine turns with tapered inner walls to prevent racetrack peak broadening in capillary electrophoresis.
Ensure all vector intersection corners have minimum fillet radii ($R \ge 25 ext{ µm}$) to eliminate dead-volume stagnation bubbles during electrokinetic injection.

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