Optics & Display Glass Processing
Laser Glass Filamentation & Thermal Shock Cleaving Calculator
Model picosecond laser multi-photon absorption filamentation, localized CO2 laser thermal expansion stresses, and coolant quenching crack propagation for chip-free cutting of ultra-thin and chemically strengthened glass.
Process Parameters & Inputs
Glass thickness in mm (e.g., 0.7mm for display cover glass, 1.1mm for solar).
Ultrafast laser average power in Watts (1064nm / 532nm).
Linear galvanometer or XY stage scan speed in mm/s.
Thermal expansion coefficient in ×10^-6 /K (Borosilicate: 3.3, Soda-Lime: 8.5).
Trailing distance between laser heating beam and cooling aerosol jet in mm.
Calculated Engineering Metrics
Filament Channel Depth
680µm
Thermal Stress Peak
185MPa
Cleave Crack Velocity
480mm/s
Edge Micro-Crack HAZ
< 1.5µm
Toolpath & Geometry Simulation
Engineering Reference:
→ Read the Laser Glass Scribing & Thermal Shock Cleaving Prepress Vector Guide
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Laser glass cutting utilizes non-linear multi-photon absorption with Bessel beam axicon optics to generate continuous high-aspect-ratio sub-micron filamentation channels through the entire glass substrate.
Filamentation Depth & Thermal Shock Stress:
z_{filament} = \frac{2 \pi w_0 \cdot n_{glass}}{\lambda} \cdot \left(\frac{P_{laser}}{P_{crit}}\right)^{0.5}\sigma_{thermal} = \frac{E \cdot \alpha \cdot \Delta T}{1 - \nu}v_{crack} = \frac{K_{IC} \sqrt{\pi}}{\sigma_{thermal} \sqrt{a_{vent}}}
A trailing CO2 laser or air-water mist quench jet induces steep tensile thermal shock, causing clean median crack propagation with zero edge chipping ($Ra < 0.2\text{ µm}$).