Printed Electronics CAM

Roll-to-Roll Printed Electronics Flexo & Gravure Calculator

Calculate functional ink transfer thickness, lateral spreading choke factors, and web tension pre-distortion scaling for R2R printed electronics.

Process Parameters & Inputs

Target Conductive Line Width (µm)

Desired conductive trace width after sintering.

Anilox / Gravure Cell Volume (BCM/in²)

Theoretical wet ink delivery volume.

Silver / Carbon Ink Solid Content (%)

Nanoparticle or micro-flake solid volume loading.

Web Tension Stretch Factor (%)

Longitudinal web elongation on PET / Polyimide film.

Calculated CAM & Engineering Metrics

Phototool / Cliché Choke Width

28.5µm

Dry Film Trace Thickness

1.82µm

Web Scaling Pre-Distortion

99.88%

Trace Aspect Ratio (H/W)

0.045-

Engineering Notes & Guidelines

R2R Printed Electronics Vector Rules:

Liquid silver nanoparticle inks spread laterally upon substrate contact ($W_{ ext{printed}} = W_{ ext{plate}} + 2 imes ext{spread}$). The plate artwork must be choked accordingly.
All trace right-angle turns must be filleted with curved bends ($R \ge 3 imes W$) to eliminate local current crowding and ink bead necking.
Align grid vectors at 45° or 60° relative to anilox cell mesh lines to prevent moiré screening beat patterns and uneven ink pooling.

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