Semiconductor Packaging & Wire Bonding
Ultrasonic Wire Bonding & Wedge Loop Clearance Calculator
Determine transducer acoustic scrub power, trapezoidal loop trajectory height, wire neck deformation %, and bond pad keep-out clearance envelopes for gold, aluminum, and copper microelectronic wire bonding.
Process Parameters & Inputs
Standard microelectronic wire diameter in micrometers (µm).
Horizontal distance between 1st bond (die) and 2nd bond (leadframe/substrate) in mm.
Vertical Z-height difference between die pad and substrate pad in mm.
Piezoelectric transducer resonant driving frequency in kHz.
Peak-to-peak wedge tool scrub displacement amplitude in micrometers (µm).
Calculated Engineering Metrics
Max Loop Apex Height
485µm
Acoustic Scrub Power
320mW
Neck Deformation Ratio
22.4%
Pad Keep-Out Clearance
68µm
Toolpath & Geometry Simulation
Engineering Reference:
→ Read the Ultrasonic Wire Bonding & Wedge Bonding Prepress CAM Vector Guide
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Convert to Scalable Vector →Engineering Principles & Formula Reference
Ultrasonic wedge and ball bonding rely on solid-state atomic interdiffusion governed by acoustic power dissipation ($P = \frac{1}{2} k \omega^2 A^2$) and normal clamping downforce.
Trapezoidal Wire Loop Trajectory & Scrub Power:
H_apex = ΔH + \sqrt{L_{span}^2 - (\Delta X)^2} \cdot \sin(\theta_{kink}) + 2.5 d_{wire}P_{scrub} = \frac{1}{2} \cdot Z_{acoustic} \cdot (2\pi f_{US})^2 \cdot A_{scrub}^2\Delta d_{neck} = d_{wire} \cdot (1 - \sqrt{1 - \varepsilon_{compression}})
Ensuring minimum loop clearance prevents wire sag shorts and tail bond liftoff during high-acceleration epoxy transfer molding encapsulation.