Electrochemical Surface Finishing
Electropolishing (EP) Current Density & Surface Roughness Calculator
Calculate anodic dissolution plateau current density ($J_{\text{plateau}}$), Faraday dwell time ($t$), conforming cathode area ratio ($A_c / A_a \ge 1.5$), and sub-micron surface leveling for medical implants and high-purity piping.
Electrochemical Parameters & Inputs
1 dm² = 100 cm² = 15.5 in² (stent tube, vessel interior, or manifold).
Uniform stock removal to dissolve micro-burrs and recast layer (typical 8–20 µm).
Viscosity and limiting diffusion rate depend heavily on bath temperature.
Distance between conforming cathode fixture and workpiece.
Pre-electropolishing surface roughness from CNC machining or laser cutting.
Calculated Electropolishing Metrics
Limiting Current Density
0.0 A/dm²
Total Required Current
0.0 Amps
Process Dwell Time
0 sec
Estimated Final Roughness
0.00 µm
Micro-Asperity Dissolution Simulation
Conforming Cathode Area: 0.0 dm²
Estimated Cell Voltage: 0.0 V
Designing conforming cathodes & titanium racks?
Learn ASTM B912 prepress rules, dielectric masking offsets, and degassing vent hole DXF requirements in our technical guide.
Read Electropolishing Prepress & Conforming Cathode DXF Guide →Conforming Cathode CAD & Vector Prepress
Generate 1:1 DXF cutpaths for laser-cut titanium conforming cathode tooling, copper busbars, and vinyl dielectric masking stencils.
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